The 13th Annual G.V. Samsonov Memorial International Lecture Series at the Department of Materials Science & Engineering, IIT Kanpur, featured Mr. Hem Takiar, Corporate Vice President of Package Development & Engineering at Micron Technology. With over 40 years of experience in semiconductor packaging, Mr. Takiar is a leading expert in the field. He holds over 200 patents, including co-inventing the MicroSD card. Throughout his career, he held leadership roles at various companies, driving innovations in semiconductor packaging and manufacturing.

In his talk, Mr. Takiar discussed the rising demand for advanced packaging solutions in the semiconductor market, particularly for DRAM and NAND memories. He focused on material innovations aimed at improving performance, cost-efficiency, and miniaturization, such as high thermal conductivity materials and low-temperature solders. He also emphasized how partnerships with Indian universities can enhance research and education in IC packaging and manufacturing, fostering innovation and strengthening India's role in the global semiconductor industry.